SIKA SikaBond T55J 16kg | WPD Group

1-component elastic wood flooring adhesive with good workability.


SikaBond® T-55 J is a one-part polyurethane adhesive for direct elastic bonding of timber floors. The adhesive is of low viscosity and cures on exposure to atmospheric moisture

  • Adhesive can be sanded
  • Floor can be walked on / sanded after 12 to 24 hours
  • Elastic, footfall-sound dampening properties

Usage

SikaBond® T-55 J is designed for full surface wood floor bonding of solid and engineered wood floors and subfloors.  


Advantages

  • Adhesive can be sanded
  • Floor can be walked on / sanded after 12 to 24 hours
  • Elastic, footfall-sound dampening properties
  • Good elasticity
  • Suitable for use with underfloor heating
  • Suitable for bonding directly onto old ceramic tiles
  • Reduces stress transfer between the wood floor and the substrate
  • Low VOC content

Packaging

  • 600 ml foil pack
  • 16 kg pail

Colour

  • Ochre

Composition

  • Polyurethane

Shelf life

SikaBond® T-55 J has a shelf life of 9 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

Storage conditions

SikaBond® T-55 J shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

Density

1.35 kg/l approx.

(ISO 1183-1)


Consumption

Full Surface Bonding:

  • 600−800 g/m2 with notched trowel B3 e.g. for lam parquet, mosaic parquet and industrial parquet.
  • 700−900 g/m2 with notched trowel B6 e.g. for engineered wood strips and planks, lam and mosaic parquet.
  • 800−1000 g/m2 with notched trowel B11 e.g. solid wood, engineered long-strips and panels, industrial parquet, other residential wood floors and paving, and chipboard.

For bonding long or wide boards, or when working on uneven substrates, it may be necessary to use a notched trowel with bigger notches to ensure that a sufficient amount of SikaBond® T-55 J is applied to provide a uniform adhesive surface and prevent hollow sections i.e. without full surface bond. For substrates primed with Sika® Primer MR Fast or Sika® Primer MB, the consumption of SikaBond® T-55 J may be reduced.

Downloads

SikaBond T-55 J PDS

SikaBond T-55 J SDS